The new High Temp Diamond Compound has been specifically formulated with the mold polishing professional in mind. In the past, a compound that cut quickly might leave a higher finish, resulting in additional finishing steps to massage the mold back to its original state.
Taking into consideration that larger molds must often be polished in the plastic injection machine, the carrier in our High Temp Diamond Compound has a high vaporization point, which permits working on molds which have not yet cooled.
The new High Temp Diamond Compound takes the compromise out of polishing. This breakthrough formula results in faster stock removal and few polishing steps.
Features:
Taking into consideration that larger molds must often be polished in the plastic injection machine, the carrier in our High Temp Diamond Compound has a high vaporization point, which permits working on molds which have not yet cooled.
The new High Temp Diamond Compound takes the compromise out of polishing. This breakthrough formula results in faster stock removal and few polishing steps.
Features:
- Made specifically for hot surface finishing up to 500°F
- High vaporization point which permits working on molds which have not cooled yet.
- Specifically for mold polishing
- Saves time and improves productivity
Custom Field
Color Yellow
Grit 3 Micron
__SDS File 1 https://gessweinftp.s3.amazonaws.com/sds/EN0430/00260.pdf
Syringe Size 10g
Max Temp 500°F
__UOM Description Each
__uomdescrip Each
Abrasive Diamond
Concentration Strong
